Influence of pad shape on self-alignment in electronic...

Journal of Electronic Materials 2006 Vol. 35; Iss. 3

Influence of pad shape on self-alignment in electronic packaging

Do H. Ahn, Jihye Lee, Choong D. Yoo, Yong-Seog Kim
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Volume:
35
Year:
2006
Language:
english
Pages:
5
DOI:
10.1007/bf02690527
File:
PDF, 387 KB
english, 2006
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