Application of Au-Sn eutectic bonding in hermetic...

Journal of Electronic Materials 2006 Vol. 35; Iss. 3

Application of Au-Sn eutectic bonding in hermetic radio-frequency microelectromechanical system wafer level packaging

Qian Wang, Sung-Hoon Choa, Woonbae Kim, Junsik Hwang, Sukjin Ham, Changyoul Moon
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Volume:
35
Year:
2006
Language:
english
Pages:
8
DOI:
10.1007/bf02690529
File:
PDF, 290 KB
english, 2006
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