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In situ study on the effect of Cu 5 Zn 8 intermetallic layer on the Cu-Ni cross-interaction in Cu/Sn-9Zn/Ni interconnect under temperature gradient
Zhong, Y., Zhao, N., Dong, W., Wang, Y.P., Ma, H.T.Volume:
216
Language:
english
Journal:
Materials Chemistry and Physics
DOI:
10.1016/j.matchemphys.2018.06.009
Date:
September, 2018
File:
PDF, 2.42 MB
english, 2018