Electroless nickel/gold bump in the flip-chip-type CMOS...

Electroless nickel/gold bump in the flip-chip-type CMOS package for mobile-phone camera modules

Joong-Do Kim
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Volume:
35
Year:
2006
Language:
english
Pages:
6
DOI:
10.1007/bf02692446
File:
PDF, 272 KB
english, 2006
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