Intermetallic formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with immersion Ag surface finish
Tung-Han Chuang, Shiu-Fang Yen, Hui-Min WuVolume:
35
Year:
2006
Language:
english
Pages:
9
DOI:
10.1007/bf02692451
File:
PDF, 765 KB
english, 2006