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[IEEE 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition - Warsaw (2017.9.10-2017.9.13)] 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition - Reliability of copper-based interconnections for power devices
Guziewicz, Marek, Pagowska, Karolina, Laszcz, Adam, Mysliwiec, MarcinYear:
2017
Language:
english
DOI:
10.23919/EMPC.2017.8346926
File:
PDF, 717 KB
english, 2017