Bulk Soldering: Conductive Polymer Composites filled with copper particles and solder
Amoabeng, Derrick, Velankar, Sachin S.Language:
english
Journal:
Colloids and Surfaces A: Physicochemical and Engineering Aspects
DOI:
10.1016/j.colsurfa.2018.06.013
Date:
June, 2018
File:
PDF, 1.44 MB
english, 2018