[IEEE 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Toulouse, France (2018.4.15-2018.4.18)] 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - On the applicability of single-layer integrated microchannel cooling in 3D ICs
Zajac, Piotr, Janicki, Marcin, Napieralski, AndrzejYear:
2018
Language:
english
DOI:
10.1109/EuroSimE.2018.8369905
File:
PDF, 609 KB
english, 2018