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[ASME ASME 2003 International Electronic Packaging Technical Conference and Exhibition - Maui, Hawaii, USA (July 6–11, 2003)] 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1 - BCB Wafer Bonding Compatible With Bulk Micro Machining
Hwang, Tao-Joo, Popa, Dan O., Lu, Jian-Qiang, Kang, Byoung-Hun, Stephanou, Harry E.Year:
2003
Language:
english
DOI:
10.1115/ipack2003-35011
File:
PDF, 1.17 MB
english, 2003