[IEEE 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition - Warsaw (2017.9.10-2017.9.13)] 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition - High efficient mid power modules by next generation chip embedding technology
Essig, Kay S, Yannou, Jean-Marc, Chiu, C T, Kuo, Jarris, Chen, PhidiaYear:
2017
Language:
english
DOI:
10.23919/EMPC.2017.8346864
File:
PDF, 1.55 MB
english, 2017