[IEEE 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Toulouse (2018.4.15-2018.4.18)] 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Lift off reliability model for aluminum and copper wire bonds
Guyenot, M., Maniar, Y., Reinold, M., Rittner, M.Year:
2018
Language:
english
DOI:
10.1109/EuroSimE.2018.8369935
File:
PDF, 628 KB
english, 2018