Development of Biphenyl Epoxy Type Molding Compound for...

NIPPON KAGAKU KAISHI 2001 Iss. 9

Development of Biphenyl Epoxy Type Molding Compound for Surface Mount Devices.

HONDA, Shiro, TANAKA, Masayuki, SAWAMURA, Yasushi, TOKUNAGA, Atsuto, KAYABA, Keiji
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Year:
2001
Journal:
NIPPON KAGAKU KAISHI
DOI:
10.1246/nikkashi.2001.523
File:
PDF, 1.77 MB
2001
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