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Deposition Mechanism of Electroless Ni-Cu-P Alloy Plating.
NAWAFUNE, Hidemi, UEGAKI, Takashi, MIZUMOTO, Shozo, ISHIKAWA, Masami, NAKAMURA, TsuneshiVolume:
48
Year:
1997
Journal:
Journal of the Surface Finishing Society of Japan
DOI:
10.4139/sfj.48.468
File:
PDF, 282 KB
1997