The use of theT*-integral to simulate subcritical crack...

Strength of Materials 1997 / 05-06 Vol. 29; Iss. 3

The use of theT*-integral to simulate subcritical crack growth taking into account the evolution of pores in the material

B. Z. Margolin, V. I. Kostylev
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Volume:
29
Language:
english
Pages:
11
DOI:
10.1007/bf02767437
Date:
May, 1997
File:
PDF, 802 KB
english, 1997
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