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[IEEE 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Toulouse (2018.4.15-2018.4.18)] 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Combined SPICE-FEM analysis of electrothermal effects in InGaP/GaAs HBT devices and arrays for handset applications
d'Alessandro, Vincenzo, Catalano, Antonio Pio, Codecasa, Lorenzo, Moser, Brian, Zampardi, Peter J.Year:
2018
Language:
english
DOI:
10.1109/EuroSimE.2018.8369866
File:
PDF, 1.18 MB
english, 2018