[IEEE 2018 19th International Conference on Thermal,...

[IEEE 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Toulouse (2018.4.15-2018.4.18)] 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - BGA strip warpage induced by assembly process and the practical prediction methodology

Duca, Roseanne, Luan, Jing En, Hla, Phone Maw, Villa, Claudio Maria, Rovitto, Marco

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Year:

2018

Language:

english

DOI:

10.1109/EuroSimE.2018.8369877

File:

PDF, 1.34 MB

english, 2018

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