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[IEEE 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Toulouse (2018.4.15-2018.4.18)] 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - BGA strip warpage induced by assembly process and the practical prediction methodology
Duca, Roseanne, Luan, Jing En, Hla, Phone Maw, Villa, Claudio Maria, Rovitto, MarcoYear:
2018
Language:
english
DOI:
10.1109/EuroSimE.2018.8369877
File:
PDF, 1.34 MB
english, 2018