[IEEE 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Toulouse (2018.4.15-2018.4.18)] 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - 3D hybrid bonding assembly studied by scanning thermal microscopy, resistive thermometry and Finite Element Modelling
Pic, Axel, Prffito, Rafael, Gallois-Garreignot, Sebastien, Colonna, Jean-Philippe, Fiori, Vincent, Chapuis, Pierre-OlivierYear:
2018
Language:
english
DOI:
10.1109/EuroSimE.2018.8369884
File:
PDF, 873 KB
english, 2018