[IEEE 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Toulouse (2018.4.15-2018.4.18)] 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - A thermo-mechanical fatigue damage modeling methodology for power semiconductor robustness validation studies
Springer, Martin, Pettermann, Heinz E.Year:
2018
Language:
english
DOI:
10.1109/EuroSimE.2018.8369908
File:
PDF, 538 KB
english, 2018