IEEE ITRW Working Group Position Paper-Packaging and...

IEEE ITRW Working Group Position Paper-Packaging and Integration: Unlocking the Full Potential of Wide-Bandgap Devices

Johnson, Mark, Wilson, Peter R., Empringham, Lee, De Lillo, Liliana
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Volume:
5
Language:
english
Journal:
IEEE Power Electronics Magazine
DOI:
10.1109/MPEL.2018.2822246
Date:
June, 2018
File:
PDF, 2.03 MB
english, 2018
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