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[IEEE 2018 29th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) - Saratoga Springs, NY, USA (2018.4.30-2018.5.3)] 2018 29th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) - Modelling pattern dependent variations in semi-additive copper electrochemical plating: AP/DFM: Advanced patterning / design for manufacturability
Lang, Christopher, Boning, DuaneYear:
2018
Language:
english
DOI:
10.1109/ASMC.2018.8373169
File:
PDF, 943 KB
english, 2018