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[IEEE 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Mie, Japan (2018.4.17-2018.4.21)] 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) - High density flex-cable and interconnection technologies for large silicon detector modules
Blank, Thomas, Pfistner, P., Leyrer, B., Caselle, M., Simons, C., Schmidt, C. J., Weber, M.Year:
2018
Language:
english
DOI:
10.23919/ICEP.2018.8374306
File:
PDF, 3.01 MB
english, 2018