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[IEEE 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Mie, Japan (2018.4.17-2018.4.21)] 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) - SiC power module for motor driving system
Liu, Chun-Kai, Tzeng, Chih-Ming, Fang, Rong-Chang, Li, Chih-Wei, Goo, JamesYear:
2018
Language:
english
DOI:
10.23919/ICEP.2018.8374324
File:
PDF, 515 KB
english, 2018