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The development of copper wire bonding for plastic molded semiconductor packages.
Hirota, Jitsuho, Machida, Kazumichi, Okuda, TakioVolume:
4
Year:
1986
Language:
english
Journal:
QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY
DOI:
10.2207/qjjws.4.603
File:
PDF, 4.17 MB
english, 1986