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[IEEE 2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - ROMA, Italy (2018.5.22-2018.5.25)] 2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Post-fabrication soft trimming of resistive sensors
Shankhour, Ibrahim, Mohdad, Jad, Mailly, Frederick, Nouet, PascalYear:
2018
Language:
english
DOI:
10.1109/DTIP.2018.8394221
File:
PDF, 1.57 MB
english, 2018