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Thermal Cycling Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint Using Type-I Censored Data
Mi, Jinhua, Li, Yan-Feng, Yang, Yuan-Jian, Peng, Weiwen, Huang, Hong-ZhongVolume:
2014
Year:
2014
Language:
english
Journal:
The Scientific World Journal
DOI:
10.1155/2014/807693
File:
PDF, 3.15 MB
english, 2014