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Modeling and Electromagnetic Analysis of Multilayer Through Silicon Via Interconnect for 3D Integration
Yan, Zhaowen, Kang, Ting, Zhang, Wei, Wang, JianweiVolume:
2015
Year:
2015
Language:
english
Journal:
International Journal of Antennas and Propagation
DOI:
10.1155/2015/470952
File:
PDF, 4.97 MB
english, 2015