[IEEE 2018 Symposium on Design, Test, Integration &...

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[IEEE 2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - ROMA, Italy (2018.5.22-2018.5.25)] 2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Blood flow sensor with built-in contact pressure and temperature sensor

Sawada, R., Nogami, H., Inoue, R., Higurashi, E.
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Year:
2018
Language:
english
DOI:
10.1109/DTIP.2018.8394232
File:
PDF, 534 KB
english, 2018
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