[IEEE 2018 Symposium on Design, Test, Integration &...

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[IEEE 2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - ROMA, Italy (2018.5.22-2018.5.25)] 2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Energy efficient micro-machined thermal flow-rate sensor based on transient operation mode

Shaun, Ferdous, Sarkar, Sreyash, Ali, Hany, Poulichet, Patrick, Peressutti, Francesco, Marty, Frederic, Bourouina, Tarik, Nefzaoui, Elyes, Oliveira, Joao Pedro
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Year:
2018
Language:
english
DOI:
10.1109/DTIP.2018.8394233
File:
PDF, 277 KB
english, 2018
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