[IEEE 2018 Symposium on Design, Test, Integration &...

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[IEEE 2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - ROMA, Italy (2018.5.22-2018.5.25)] 2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Optical characterization of an infrared neural optrode

Horvath, Agoston Csaba, Boros, Csanad Ors, Sepsi, Ors, Beleznai, Szabolcs, Koppa, Pal, Fekete, Zoltan
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Year:
2018
DOI:
10.1109/DTIP.2018.8394242
File:
PDF, 426 KB
2018
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