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Investigation of the Influence of the Cure Shrinkage in Electrically Conductive Adhesive, and the Mechanism for Conductivity
KOHINATA, Shigeru, SHIRAKI, Yoshihiko, INOUE, Masahiro, UENISHI, KeisukeVolume:
3
Year:
2014
Language:
english
Journal:
Journal of Smart Processing
DOI:
10.7791/jspmee.3.246
File:
PDF, 1.68 MB
english, 2014