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Highly Densified Cu Wirings Fabricated from Air-Stable Cu Complex Ink with High Conductivity, Enhanced Oxidation Resistance, and Flexibility
Li, Wanli, Yang, Yang, Zhang, Bowen, Li, Cai-Fu, Jiu, Jinting, Suganuma, KatsuakiLanguage:
english
Journal:
Advanced Materials Interfaces
DOI:
10.1002/admi.201800798
Date:
July, 2018
File:
PDF, 2.26 MB
english, 2018