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[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - Thermal Resistance of Bond-Lines Formed With Composite Thermal Interface Materials
Lehmann, Gary, Zhang, Hao, Gowda, Arun, Esler, DavidYear:
2005
Language:
english
DOI:
10.1115/IPACK2005-73380
File:
PDF, 581 KB
english, 2005