[IEEE 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition - Warsaw (2017.9.10-2017.9.13)] 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition - Comparison of microvia HDI PCBs with ACF interconnections in accelerated life testing
Frisk, L., Lahokallio, S., Kiilunen, J.Year:
2017
Language:
english
DOI:
10.23919/EMPC.2017.8346870
File:
PDF, 887 KB
english, 2017