[IEEE 2018 Symposium on Design, Test, Integration &...

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[IEEE 2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - ROMA, Italy (2018.5.22-2018.5.25)] 2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Integrated thermally actuated MEMS switch with the signal line for the out-of-plane actuation

Pustan, Marius, Birleanu, Corina, Dudescu, Cristian, Muller, Raluca, Baracu, Angela
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Year:
2018
Language:
english
DOI:
10.1109/DTIP.2018.8394201
File:
PDF, 1.47 MB
english, 2018
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