[IEEE 2018 Symposium on Design, Test, Integration &...

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[IEEE 2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - ROMA, Italy (2018.5.22-2018.5.25)] 2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - A polymeric microtweezer with integrated force/displacement sensor

Voicu, Rodica-Cristina, Tibeica, Catalin, Muller, Raluca
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Year:
2018
DOI:
10.1109/DTIP.2018.8394238
File:
PDF, 688 KB
2018
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