[IEEE 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Mie, Japan (2018.4.17-2018.4.21)] 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Ag joint bonding technology for bare copper substrate in low temperature, pressureless and air condition
Zhang, Zheng, Chen, Chuantong, Zhang, Hao, Nagao, Shijo, Suganuma, KatsuakiYear:
2018
Language:
english
DOI:
10.23919/ICEP.2018.8374669
File:
PDF, 3.94 MB
english, 2018