Novel silver die-attach technology on silver pre-sintered DBA substrates for high temperature applications
Nishimoto, Shuji, Moeini, Seyed Ali, Ohashi, Toyo, Nagatomo, Yoshiyuki, McCluskey, PatrickVolume:
87
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2018.06.010
Date:
August, 2018
File:
PDF, 2.49 MB
english, 2018