[IEEE 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition - Warsaw (2017.9.10-2017.9.13)] 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition - Influence of various micro channels integrated in LTCC multilayer module on the thermal resistance
Girasek, Tomas, Pietrikova, Alena, Welker, Tilo, Muller, JensYear:
2017
Language:
english
DOI:
10.23919/EMPC.2017.8346880
File:
PDF, 975 KB
english, 2017