Multi-port dynamic compact thermal models of dual-chip...

Microelectronics Reliability 2018 / 08 Vol. 87

Multi-port dynamic compact thermal models of dual-chip package using model order reduction and metaheuristic optimization

Rogié, Brice, Codecasa, Lorenzo, Monier-Vinard, Eric, Bissuel, Valentin, Laraqi, Najib, Daniel, Olivier, D'Amore, Dario, Magnani, Alessandro, d'Alessandro, Vincenzo, Rinaldi, Niccolò
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Volume:
87
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2018.06.009
Date:
August, 2018
File:
PDF, 1.85 MB
english, 2018
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