[IEEE 2018 Symposium on Design, Test, Integration &...

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[IEEE 2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Roma (2018.5.22-2018.5.25)] 2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - FIB-induced damage in graphene electrodes for piezoelectric resonators

Saadani, A., Lavenus, P., Le Traon, O., Heripre, E., Sthal, F.
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Year:
2018
Language:
english
DOI:
10.1109/DTIP.2018.8394206
File:
PDF, 582 KB
english, 2018
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