A simple metal-semiconductor substructure for the advanced thermo-mechanical numerical modeling of the power integrated circuits
Bojita, Adrian, Boianceanu, Cristian, Purcar, Marius, Florea, Ciprian, Simon, Dan, Plesa, Cosmin-SorinVolume:
87
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2018.06.013
Date:
August, 2018
File:
PDF, 4.09 MB
english, 2018