A simple metal-semiconductor substructure for the advanced...

A simple metal-semiconductor substructure for the advanced thermo-mechanical numerical modeling of the power integrated circuits

Bojita, Adrian, Boianceanu, Cristian, Purcar, Marius, Florea, Ciprian, Simon, Dan, Plesa, Cosmin-Sorin
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
87
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2018.06.013
Date:
August, 2018
File:
PDF, 4.09 MB
english, 2018
Conversion to is in progress
Conversion to is failed