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[IEEE 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Mie, Japan (2018.4.17-2018.4.21)] 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Investigation of aluminum patterned electrodeposition process from AlCl3-[EMIm]Cl ionic liquid for microsystems application
Farisi, Muhammad Salman Al, Hertel, Silvia, Wiemer, Maik, Otto, ThomasYear:
2018
Language:
english
DOI:
10.23919/ICEP.2018.8374336
File:
PDF, 3.81 MB
english, 2018