Electrochemical Formation and Accumulation of Cu(I) in Copper Sulfate Electroplating Solution
Koga, Toshiaki, Nonaka, Kazuhiro, Sakata, Yoshitaro, Terasaki, NaoVolume:
165
Year:
2018
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/2.0301810jes
File:
PDF, 531 KB
english, 2018