Novel RDL Design of Wafer-Level Packaging for Signal/Power Integrity in LPDDR4 Application
Wu, Kai-Bin, Kuo, Tsung-Yi, Hung, Cheng-Chou, Lin, Benson, Peng, I-Hsuan, Yang, M.-T., Wu, Ruey-BeeiYear:
2018
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2018.2850528
File:
PDF, 3.88 MB
english, 2018