Investigating on Through Glass via Based RF Passives for 3-D Integration
Qian, Libo, Sang, Jifei, Xia, Yinshui, Wang, Jian, Zhao, PeiyiVolume:
6
Year:
2018
Language:
english
Journal:
IEEE Journal of the Electron Devices Society
DOI:
10.1109/JEDS.2018.2849393
File:
PDF, 1.21 MB
english, 2018