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[IEEE 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition - Warsaw (2017.9.10-2017.9.13)] 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition - Embedding technologies for heterogeneous integration of components in PCBs-an innovative modularisation approach with environmental impact
Manessis, D., Pawlikowski, J., Ostmann, A., Schischke, K., Aschenbrenner, R., Schneider-Ramelow, M., Krivec, T., Podhradsky, G., Lang, K-D.Year:
2017
Language:
english
DOI:
10.23919/EMPC.2017.8346879
File:
PDF, 2.37 MB
english, 2017