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Thermal Sensitive Shape Memory Behavior of Epoxy Composites Reinforced with Silicon Carbide Whiskers
Wang, Yongkun, Tian, Wenchao, Liu, Xiaohan, Ye, JunjieVolume:
7
Language:
english
Journal:
Applied Sciences
DOI:
10.3390/app7010108
Date:
January, 2017
File:
PDF, 3.53 MB
english, 2017