The Challenges of Advanced CMOS Process from 2D to 3D

Applied Sciences 2017 / 10 Vol. 7; Iss. 10

The Challenges of Advanced CMOS Process from 2D to 3D

Radamson, Henry, Zhang, Yanbo, He, Xiaobin, Cui, Hushan, Li, Junjie, Xiang, Jinjuan, Liu, Jinbiao, Gu, Shihai, Wang, Guilei
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Volume:
7
Language:
english
Journal:
Applied Sciences
DOI:
10.3390/app7101047
Date:
October, 2017
File:
PDF, 9.27 MB
english, 2017
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