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Evaluation of Thin Copper Wire and Lead-Free Solder Joint Strength by Pullout Tests and Wire Surface Observation
Tada, Naoya, Tanaka, Takuhiro, Uemori, Takeshi, Nakata, ToshiyaVolume:
7
Language:
english
Journal:
Crystals
DOI:
10.3390/cryst7080255
Date:
August, 2017
File:
PDF, 12.40 MB
english, 2017