Numerical simulation of mold filling in resin transfer molding using isoparametric method
Zhang Kaipeng, Tan Hua, Wang Jihui, Zhu YingdanVolume:
20
Language:
english
Pages:
4
DOI:
10.1007/bf02870885
Date:
March, 2005
File:
PDF, 757 KB
english, 2005